Method for applying a final metal layer for wafer level packaging and associated device

ABSTRACT

A wafer level semiconductor device and manufacturing method including providing a semiconductor device wafer substitute having a backside, applying to the backside a conductive metallization layer, and applying to the backside over the conductive metallization layer a protective metal layer of titanium, titanium alloys, nickel, nickel alloys, chromium, chromium alloys, cobalt, cobalt alloys, palladium, and palladium alloys.

CROSS REFERENCE TO RELATED APPLICATIONS

This divisional application claims the benefit of priority of U.S.Non-Provisional patent application Ser. No. 13/789,411, filed Mar. 7,2013, entitled Method For Applying A Corrosion Resistant Final MetalLayer Atop Previous Backside Metal Layer(s) For Wafer Level Packaging,which claims priority from Provisional Patent Application Ser. No.61/658,788, filed Jun. 12, 2012, entitled Method For Applying ACorrosion Resistant Final Metal Layer Atop Previous Backside MetalLayer(s) For Wafer Level Packaging. The disclosure of both applicationsis hereby incorporated by reference in its entirety.

FIELD

The present disclosure generally relates to a structure and method forsemiconductor devices, and more particularly to a structure and methodfor electronic wafer-level chip-scale packaging and flip-chip packagingand assembly.

BACKGROUND

Backside metallization depositions/coatings can be applied to thesemiconductor chips or other microelectronic devices via sputtering,evaporation, electroplating, electroless plating etc. which aredeposition technologies that are known to those familiar with the art.There are a variety of reasons metallizations are placed on the backsideof the semiconductor substrate in the semiconductor industry. They canbe used on integrated circuits to help dissipate heat buildup duringoperation of the device. They can also be used to modify the electricalproperties of the semiconductor substrate. They can also be used toincrease the mechanical strength or reliability of a thinned substratefollowing a backgrind process.

Backside metallization layer(s) are generally placed on the backside ofthinly ground or full thickness chips/devices while the chips/devicesare still in wafer form.

Backside metallization requires suitable adhesion between thesemiconductor substrate material and the initial backside metallizationlayer. Subsequent metal layers can then be applied dependent on theintended application provided the added metal depositions/coatings havea suitable level of adhesion between layers for long term reliability.

Copper and its alloys are highly used backside metallization layers dueto their high electrical conductivity and thermal heat transfer; howeverCu and its alloys can become corroded or oxidized in subsequentprocessing steps, during assembly, and/or subjected to high humidityenvironments.

A corroded or oxidized backside metal surface presents a variety ofproblems which could include but are not limited to: a discoloredbackside surface that will interfere with automated assembly visionrequirements (especially if a laser marking is present), increased riskof extended corrosion shortening the life of the part, increased risk ofextended corrosion inhibiting the overall performance of the device.

One known solution is to apply an outer corrosion resistantmetallization layer of gold, platinum, silver, platinum or palladium.However, the cost of each of these metals is prohibitively high.Therefore a more cost effective solution is needed.

SUMMARY OF THE DISCLOSURE

This disclosure provides a cost effective corrosion/oxidation resistantbackside protective metal layer atop any layer of Copper and its alloysand any other previously applied backside metal layer that issusceptible to the problems described above. This will thereby provide asurface that is chemically and mechanically viable through subsequentprocessing steps, assembly, and throughout the life of the assembledpart.

A reliable and manufacturable method for applying a corrosion andoxidation resistant metal layer atop previously applied backside metallayer(s) for thinned and full thickness semiconductor substrates hasbeen invented. The deposition of this metal layer can be accomplishedthrough sputtering, evaporation, immersion plating, electroless plating,or other deposition/coating techniques.

The method in accordance with this disclosure includes providing asemiconductor device such as a Wafer-Level Chip-Scale package (WLCSP)device that has at least an outer backside metal layer that issusceptible to corrosion or discoloration; and applying a protectivemetal layer to the outer backside metal layer wherein the protectivemetal is selected from the group consisting of Titanium, TitaniumAlloys, Nickel, Nickel Alloys, Chromium, Chromium Alloys, Cobalt andCobalt Alloys, Palladium and Palladium Alloys.

The device in accordance with this disclosure include a semiconductorwafer substrate having a backside and a conductive prior metallizationlayer on the backside, and a protective metal layer over themetallization layer wherein the protective metal is selected from thegroup consisting of Titanium, Titanium alloys, Nickel, Nickel alloys,Chromium, Chromium alloys, Cobalt, Cobalt alloys, Palladium andPalladium alloys.

BRIEF DESCRIPTION OF THE DRAWINGS

For a more complete understanding of the present disclosure, referenceis now made to the following figures:

FIG. 1 illustrates a cross-sectional view of a portion of asemiconductor wafer substrate with 1/0 bond pads. This view also showsthe deposited backside metal layers.

FIG. 2 illustrates a closer cross-sectional view of the semiconductorwafer substrate and the backside metal layers.

FIG. 3 illustrates a backside view of the semiconductor substrate withbackside metallization and with a laser marking.

FIG. 4 illustrates the cross-sectional view of a portion of an assembledWLCSP device with backside metallization attached to a correspondingboard or other board side substrate.

The exemplification set out herein illustrates particular embodiments,and such exemplification is not intended to be construed as limiting inany manner,

DETAILED DESCRIPTION

One embodiment of a method in accordance with this disclosure includesproviding a semiconductor device such as a Wafer-Level Chip-Scalepackage (WLCSP) device that has at least an outer backside metal layerthat is susceptible to corrosion or discoloration; and applying aprotective metal layer of titanium to the outer backside metal layer.This titanium layer may be applied by any conventional means such asvapor deposition, sputtering, and chemical plating.

The corrosion/oxidation resistant metals for this invention include:titanium and its alloys, nickel and its alloys, chromium and its alloys,and cobalt and its alloys. This disclosure provides a means for thefinished surface to remain uniformly colored throughout the life of thepart, even in higher humidity conditions for both non-laser markapplications, as well as laser marked surfaces.

This method applies to any semiconductor substrate with previouslyapplied backside metallization that can be corroded, oxidized, and/ordiscolored and includes but is not limited to: copper and its alloys,aluminum and its alloys, silver and its alloys, tungsten and its alloys,etc. The resulting corrosion/oxidation resistant metal layer can bedeposited with a range between 10 Angstroms and 40,000 Angstroms.

In one particular embodiment of this invention the underlying metallayer is a copper plated metallization that is also subsequentlyprocessed through laser marking, which produces a laser marked backsideplated copper layer, followed by the deposition of a corrosion/oxidationresistant titanium layer. The resulting backside metallization isuniformly colorized for clear legibility of the laser marking and it ishighly resistant to corrosion or oxidation.

FIG. 1 shows a cross sectional view of an assembled WLCSP devicesubstrate 100 that includes one or more backside metal layers 102. FIG.2 is an enlarged view of the device substrate 100 in accordance with thepresent disclosure showing an adhesion metal layer 104 applied first tothe wafer substrate 106, followed by a primary backside metal layer 108,and finally application of a protective corrosion resistant metal layer110 in accordance with the present disclosure. This protective outercorrosion resistant metal layer 110 may be applied either before orafter laser etching of an identification mark 112 as shown in FIG. 3.

FIG. 4 is a cross sectional view of a completely assembled device 200 inaccordance with an embodiment of the present disclosure. The backsidemetal layers 202 comprise at least a primary layer 108 and an outercorrosion resistant layer 110 as described above with reference to FIG.2.

This disclosure includes a new method of using a final backsidemetallization layer 110 that is corrosion/oxidation resistant atoppreviously deposited/coated metal layers.

This corrosion/oxidation resistant layer can be deposited through themeans of sputtering, evaporation, immersion plating, electroless platingor other deposition/coating techniques.

Titanium and its alloys are an ideal metal for this final resistantbackside metallization layer provided its adhesion to the previouslydeposited metallization layer is suitable for reliability.

Other corrosive/oxidation resistant metals such as nickel and itsalloys, chromium and its alloys, cobalt and its alloys, Tungsten and itsalloys, as well as Palladium and its alloys are also good candidates forforming this final deposited layer provided their adhesion to thepreviously deposited metallization layer is suitable for reliability. Byusing this final backside metallization layer, the backside surface ofthe semiconductor substrate will remain uniform in appearance throughsubsequent processing of the semiconductor substrate and throughout thelife of the part.

This new method can be used in conjunction with or without lasermarking, with the laser marking occurring either before or after thedeposition of this final protective metallization layer. Preferably themethod involves using a final backside metallization layer that iscorrosion/oxidation resistant atop a previously deposited copper or oneof its alloys as the prior metallization layers. In particular, thefinal metallization layer is comprised of titanium atop a previouslyelectroplated copper or one of its alloys as the prior metallizationlayer.

One specific embodiment of this invention includes deposition of copperor one of its alloys as a first backside metallization, producing alaser marking on the first backside metallization layer, followed bydeposition of an additional metallization layer of titanium atop thepreviously deposited copper backside metallization or one of its alloys.An alternate embodiment of this invention includes deposition of copperor one of its alloys as a first backside metallization, followed bydeposition of an additional metallization layer of titanium atop apreviously deposited copper or one of its alloys, and finally creationof a laser marking on the previously deposited layer. Preferably thereis also a liquid etch step after the laser marking to remove any copperoxide before deposition of the corrosion resistant metallization layerof titanium. Furthermore, additional metallization layers may be appliedbeyond the two layers above specifically described. Preferably thecorrosion/oxidation resistant layer can be deposited in a range between10 Angstroms and 40,000 Angstroms.

Although it is known that backside metallization layers haveincorporated gold, silver, platinum, palladium, and nickel as a finaldeposited layer in a stack of metals, the specific benefit of this newmethod is that it can be applied later, such as after multiple steps ofsputtering/plating processes or sputter/plating/laser marking processes,etc. In addition, it can preferably be applied after the laser markingprocess.

Many variations will become apparent to a person of ordinary skill inthe art from a reading of this disclosure. For example, additionalmetallization layers may be applied to the backside without departingfrom the scope of the present disclosure. All such modifications andvariations are encompassed within the scope of the present disclosure.The examples cited here are to be regarded in an illustrative ratherthan a restrictive sense.

1. A wafer level device comprising: a semiconductor wafer substratehaving a backside and a laser marked metal layer on the back side; and aprotective metal layer over the laser marked metal layer wherein theprotective metal layer is comprised of a metal selected from the groupconsisting of titanium, titanium alloys, nickel, nickel alloys,chromium, chromium alloys, cobalt and cobalt alloys, palladium andpalladium alloys.
 2. The device of claim 1 wherein the protective metallayer has a thickness between about 10 Angstroms and about 40,000Angstroms.
 3. The device of claim 1 wherein the protective metal layeris made of titanium.
 4. The device of claim 1 wherein the primary metallayer is one of copper and a copper alloy.
 5. The method of claim 1wherein the backside of the semiconductor device wafer substrateconsists of only a single metal layer comprising a single metal or metalalloy that is susceptible to corrosion and a single corrosion resistantmetal layer comprising a single metal or metal alloy overlying thesingle backside metal layer.
 6. A wafer level device comprising: asemiconductor wafer substrate having a backside and a metal layer on theback side; and a protective metal layer over the backside metal layerwherein the protective metal layer is comprised of a metal selected fromthe group consisting of chromium, chromium alloys, cobalt and cobaltalloys, palladium and palladium alloys.
 7. The wafer level device ofclaim 6, further comprising an adhesion layer between the backside andthe backside metal layer.